新闻与活动
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SEMI MEMS and Sensors Summit 2017
Grenoble, France 3rd edition of the SEMI MEMS and Sensor Summit will take place in Grenoble from Sept 20th to 22nd. Looking for versatile process control solutions compliant with high volume manufacturing ? Stop by our booth #21 to learn about our TMap Series and 4See...
SEMICON Taiwan 2017
Taipei Nangang Exhibition Center, Taiwan Taiwan is a key region for UnitySC with many customers and tools installed. From Sept 13 to 15th, we will be co-exhibiting with our local representative, Kingyoup Entreprises. Visit us on booth #930, 4th floor, and learn more...
IFTLE 340 Can Unity Help Advanced Packaging Progress?
Most would agree that in order for advanced packaging solutions to lead the industry and fill the role previously held by semiconductor scaling it must see advances in infrastructure building and significant focus by all players to lower costs. For sure, this will...
Impressions from ECTC 2017
Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp from 3DInCites. [...] UnitySC filled me in on their most recent inspection platform targeting heterogeneous integration, the 4See Series, an all-surface wafer inspection system...
Fifty Shades of Fan-out Discussed at ECTC 2017
Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp from 3DInCites. The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took...
The Role of Inspection and Metrology in the Future of Advanced Packaging
What is expected from inspection and metrology equipment, and how will it evolve in the future? Advanced packaging has grown into a complex ecosystem with a variety of business models and a series of players involved, from initial wafer processing steps to final...