新闻与活动
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SEMICON China
Shanghai New Expo International Center UnitySC will be exhibiting in booth #5375 in Hall #5. New product launch planned ! www.semiconchina.org/
IMAPS Device Packaging Conference
Fountain Hills, AZ, USA UnitySC will be sponsoring the Panel discussion about Fan Out Wafer Level Packaging. Please attend this session and get in touch with our staff during the event.
Process Control Gains Importance in Advanced Packaging Applications
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM),...
SEMICON Korea
COEX, Seoul UnitySC will be co-exhibiting in booth #1778 with 3H Corporation. www.semiconkorea.org/
Welcome to a New Era of Predictive Yield Process Control for Advanced Packaging
In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology offerings of Fogale Nanotech Semicon with Altatech’s unique 2D and 3D inspection capabilities. The idea was to create a powerhouse of...
SEMI European 3D Summit
Grenoble, France UnitySC will be demonstrating its TSV and FOWLP product offer. Stop by our booth #18 www.semi.org/eu/european-3d-summit-2017