新闻与活动
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3D Architectures for Heterogeneous Integration and Packaging (3D ASIP)
San Francisco, USA Gilles Fresquet, CEO UnitySC, will deliver an invited talk entitled "TSV, FOWLP, Hybrid Bonding : Review of Metrology Challenges and Solutions to Support HVM". Check the event website for more information.
Why Ultra Thin Power Semiconductors Calls For Advanced Inspection Process Control
Article published in Silicon Semiconductor (Volume 39, Issue 4 2017) Thin and ultrathin ICs are in high demand, but yield that sacrifices reliability has little value. Inspection process control can be the solution, according to UnitySC. By Gilles Fresquet, CEO,...
克服大批量薄晶圆制造中的检测挑战
有人已经考虑将暗视野检测用于检测薄晶圆缺陷。基于光学技术，暗视野是指进行较低角度反射光测量。 暗视野对于晶圆前端检测是有效的，但是由于研磨造成晶圆背面粗糙，对于背面检测它是无效的。因此，晶圆背面研磨后应避免暗视野检测。 Read...
Technical Tidbits from IWLPC and MSEC 2017
Francoise von Trapp (3D Incites) refers to UnitySC's latest announcement in her coverage of IWLPC. After reading the announcement of UnitySC’s opening of its new software development lab and customer support demo lab, I caught up with the Philippe Gastaldo, Product...
UnitySC Expands; Opens U.S. Office With Global Software Development Center And Customer Demo Lab
New Facility Enhances Company’s Semiconductor Process Control Capabilities and Supports Growing North America Customer Base Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the...
Overcoming thin-wafer inspection challenges for high-volume manufacturing
Blog post from Philippe Gastaldo, Product and R&D Director, UnitySC. As the automotive electronics market continues to grow, spurred by developments such as semi-autonomous and fully autonomous vehicles, the demand is increasing for power semiconductor components...