新闻与活动
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Overcoming thin-wafer inspection challenges for high-volume manufacturing
Blog post from Philippe Gastaldo, Product and R&D Director, UnitySC. As the automotive electronics market continues to grow, spurred by developments such as semi-autonomous and fully autonomous vehicles, the demand is increasing for power semiconductor components...
Advanced Process Control Solutions for Fan-Out Wafer Level Packaging
Article published by UnitySC in Chip Scale Review (July-Aug 2017, Volume 21, Number 4) With the increase of costs, delays and complexity at the most advanced frontend silicon technology nodes, advanced packaging process control solutions have become a key...
Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)
Gilles Fresquet, CEO, and Yann Guillou, Global Marketing Manager, mentionned in the article written by Francoise von Trapp from 3DInCites In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on...
SEMICON Europa 2017
Munich, Germany For the first time, SEMICON Europa will be co-located with Productronica. UnitySC will be exhibiting on booth #B1-1008. To pre-arrange a meeting, send us a message.
IWLPC
San Jose, CA Wafer Level Packaging is almost everywhere: smartphones, automotive, IoT, medtech, etc... Meet with us at IWLPC on booth #10 and listen to our talk entitled "Wafer Thinning In-Line Inspection Process Control Solution for High Volume Manufacturing". To...
IMAPS 2017
Raleigh, NC UnitySC will be exhibiting on booth #421 and delivering a talk entitled "In line Advanced Process Control Solution for the Fabrication of Micro-bumps". Come to meet with us. To pre-arrange a meeting, send us a message.