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Reliable Process Control Solutions for the Growing Power Device Market, By Dr. Dario Alliata, Unity-SC
To see the complete article, you can download the magazine here : 3D InCities The First Decade Magazine The expected increase of power device markets — and more particularly insulated-gate bipolar transistor (IGBT) products for automotive and other applications — is...
UnitySC opens new Asia entity to support advanced packaging and power device markets
Unity Semiconductor Limited Company Will Provide Application Engineering and Field Service Support to Local Customers Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary,...
UnitySC names Kamel Ait-Mahiout as CEO
Ait-Mahiout Brings Strong Track Record of Growth at Amkor Europe and Significant Operational Experience Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced...
Unity SC (A FOGALE Nanotech Company) disclosed two new metrology solutions for advanced packaging applications
T-MAP 3D Time-domain Optical Coherence is the most robust solution for TSV depth, bow & warp and individual layer TTV of a stack measurement as each interface is detected in the right order over a larger range than spectral interferometry. The only limitation is...
Unitysc Acquires Hseb Dresden Gmbh to Become a Global Leader in Semiconductor Process Control
Combined Core Competencies Deliver comprehensive Inspection and Metrology Offering for FULL SPECTRUM OF SEMICONDUCTOR APPLICATIONS Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of...
2018 IEEE 68th Electronic Components and Technology Conference
San Diego, California This year again, UnitySC is proud to be Gold Sponsor of ECTC which brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. We will be...