What is expected from inspection and metrology equipment, and how will it evolve in the future?

Advanced packaging has grown into a complex ecosystem with a variety of business models and a series of players involved, from initial wafer processing steps to final package delivery and subsequent board assembly. The spotlight has turned to advanced packaging as one of the solutions to bring further value to the semiconductor product in terms of cost reduction and functionality increase […]. Our lead analysts for the areas of equipment and materials sat down with UnitySC CEO Gilles Fresquet and Global Marketing Manager Yann Guillou to discuss the trends in advanced packaging and their impact on inspection and metrology tools [I-Micronews].

Read more