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Technical Tidbits from IWLPC and MSEC 2017

by kaiss.benhadjsalem@unity-sc.com | Nov 9, 2017 | News

Francoise von Trapp (3D Incites) refers to UnitySC’s latest announcement in her coverage of IWLPC. After reading the announcement of UnitySC’s opening of its new software development lab and customer support demo lab, I caught up with the Philippe Gastaldo,...
UnitySC Expands; Opens U.S. Office With Global Software Development Center And Customer Demo Lab

UnitySC Expands; Opens U.S. Office With Global Software Development Center And Customer Demo Lab

by kaiss.benhadjsalem@unity-sc.com | Oct 23, 2017 | Press releases

New Facility Enhances Company’s Semiconductor Process Control Capabilities and Supports Growing North America Customer Base Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the...

Overcoming thin-wafer inspection challenges for high-volume manufacturing

by kaiss.benhadjsalem@unity-sc.com | Aug 24, 2017 | News

Blog post from Philippe Gastaldo,  Product and R&D Director, UnitySC. As the automotive electronics market continues to grow, spurred by developments such as semi-autonomous and fully autonomous vehicles, the demand is increasing for power semiconductor components...

Advanced Process Control Solutions for Fan-Out Wafer Level Packaging

by kaiss.benhadjsalem@unity-sc.com | Aug 4, 2017 | News

Article published by UnitySC in Chip Scale Review (July-Aug 2017, Volume 21, Number 4) With the increase of costs, delays and complexity at the most advanced frontend silicon technology nodes, advanced packaging process control solutions have become a key...

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)

by kaiss.benhadjsalem@unity-sc.com | Jul 25, 2017 | News

Gilles Fresquet, CEO, and Yann Guillou, Global Marketing Manager, mentionned in the article written by Francoise von Trapp from 3DInCites In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on...
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