IMAPS Device Packaging 2018

Fountain Hills, Arizona UnitySC will be exhibiting on booth #60. Dario Alliata, Product Manager will also deliver two talks respectively entitled Progress in Time-Domain Optical Coherence Tomography for TSV/3Di stacking Metrology and Wafer Nano Topography and Edge...

克服大批量薄晶圆制造中的检测挑战

有人已经考虑将暗视野检测用于检测薄晶圆缺陷。基于光学技术,暗视野是指进行较低角度反射光测量。 暗视野对于晶圆前端检测是有效的,但是由于研磨造成晶圆背面粗糙,对于背面检测它是无效的。因此,晶圆背面研磨后应避免暗视野检测。 Read...