Precision in semiconductor manufacturing is non-negotiable. As features shrink and designs become more complex, the demand for precise metrology has never been greater. TMAP by UnitySC offers a comprehensive optical metrology solution, tailored to meet the exacting standards of today’s semiconductor industry. Discover how TMAP ensures unmatched precision across various applications.
1. Advanced Optical Sensing Options
Broad Sensing Capabilities: TMAP is equipped with a wide array of optical sensing options, ensuring versatility in application across the semiconductor manufacturing process. From Ångström to millimeter scale, our technology adapts to measure features of almost any size, delivering accuracy and reliability where it matters most.
2. Diverse Applications of TMAP
- Detailed Feature Measurements: Utilize TMAP for critical measurements such as Through-Silicon Via’s Critical Dimensions (CDs), TSV depths, Remaining Silicon Thickness above TSVs, and other dimensions such as step heights. Our system excels in providing detailed, precise data to drive quality manufacturing decisions.
- Comprehensive Wafer and Film Analysis: TMAP excels in total wafer and distinct film measurements, including Total Thickness Variation and film-stack thicknesses. Our Field-of-View surface topography and global topography (bow/warp) analysis offer comprehensive insights into wafer integrity.
- Advanced Topography and Interface Imaging: From Ångström-scale copper pad dishing, CD measurements at embedded interfaces, to nanotopography mapping at the die level, TMAP provides in-depth imaging capabilities that push the boundaries of what’s possible in metrology.
- Wafer-to-Wafer Overlay for Bonding Control: Ensure perfect alignment and bonding with our wafer-to-wafer overlay measurement capabilities. TMAP’s precise control mechanisms are essential for advanced wafer bonding processes, enhancing device reliability and yield.
3. Versatility in Wafer Handling
Adaptable to Various Formats: TMAP isn’t just powerful; it’s also flexible. It handles a range of wafer formats, including dicing frames and specific panel formats, making it suitable for various stages of the semiconductor manufacturing process.
At UnitySC, we believe that advanced metrology is the backbone of successful semiconductor manufacturing. TMAP represents the pinnacle of optical metrology technology, designed to provide the insights necessary to maintain precision at every step of the manufacturing process.