NEWS & EVENTS
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The Role of Inspection and Metrology in the Future of Advanced Packaging
What is expected from inspection and metrology equipment, and how will it evolve in the future? Advanced packaging has grown into a complex ecosystem with a variety of business models and a series of players involved, from initial wafer processing steps to final...
2.5D, Fan-Out Inspection Issues Grow
Advanced packaging is now mainstream, but making sure these devices work properly while also cutting costs is getting harder. As advanced packaging moves into the mainstream, packaging houses and equipment makers are ratcheting up efforts to solve persistent metrology...
UNITYSC RECEIVES MULTIPLE ORDERS FOR WAFER THINNING INSPECTION SYSTEMS
Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading...
SEMICON West
San Francisco, CA 1 year ago, UnitySC was launched at SEMICON West 2016. What a busy year with so many achievements since July 2016! Stop by our booth to learn about our full advanced process control product portfolio for heterogeneous integration. UnitySC will be...
CEO Interview: Chip Equipment Supplier on a Rocket Trajectory
Metrology and inspection company Unity Semiconductor SAS (Grenoble, France), is experiencing strong growth and expects to double its sales year-on-year in 2017. We asked CEO Gilles Fresquet to explain why and provide some background. [eeNews Europe] Read more
Advanced Packaging & System Integration Technology Symposium
Wuxi, China Dario Alliata, Product Manager, will deliver a talk entitled "Advanced Packaging Process Control for High Volume Manufacturing". In addition, our Business Development team will be attending to meet with attendees and promote our product offer.