NEWS & EVENTS

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UnitySC Pushes the Boundaries of Measurement With New Nanotopography Metrology Platform

Mar 14, 2017

NST Series Provides Non-Contact Full Field Profilometry to 0.1nm Resolution; Delivers Unique Overlay Solution for Hybrid Bonding Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology...

ECTC

Feb 21, 2017

Lake Buena Vista, Florida ECTC is the premier international conference on microelectronic packaging, components, and systems technology. UnitySC is proud to be Gold Sponsor of ECTC. We will be exhibiting in booth #219 and showcasing our full product portfolio of...

SEMICON China

Feb 21, 2017

Shanghai New Expo International Center UnitySC will be exhibiting in booth #5375 in Hall #5. New product launch planned ! www.semiconchina.org/

IMAPS Device Packaging Conference

Feb 15, 2017

Fountain Hills, AZ, USA UnitySC will be sponsoring the Panel discussion about Fan Out Wafer Level Packaging. Please attend this session and get in touch with our staff during the event.

Process Control Gains Importance in Advanced Packaging Applications

Feb 14, 2017

2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM),...