Dan LEE:

“Our mission is to enable our customers to Yield higher and faster
by providing differentiated Process Control Solutions.

We are a multicultural, young, energetic company, with a high-tech focus, &
environmental awareness. We are responding to the challenge of rapid growth of
our sector, relying on our innovation skills, and patented technologies.”

Our Management Team

Picture of Dan lee
Dan Lee - Head of Metrology & Inspection
  • 30+ years in Semiconductor Industry.
  • President of KLA-Tencor S’pore (2006 – 2015)
  • Head of Customer Group, Advanced Packaging, Applied Materials (2016 – 2019).
  • Senior leadership roles in Cadence, Hewlett-Packard.
  • Experienced in Packaging Technology, Front End Wafer Fabrication Process, Metrology and Inspection, IC-Design, Test & Measurement Solutions.
  • Business Skills include Business Transformation, sales, marketing, product management, mfgg, field support, P/L.
  • Msc. In Electrical Engg, UMIST.
Picture of Isaac OW
Dr Isaac Ow - Product Office
  • General Manager, Key Product Unit Head, Applied Materials.
  • Packaging Technologies & wafer mfg process.
  • Management of Product Development, Global Product Management & Global Engineering Teams.
  • Executive management approval committee member for Product Life Cycle (PLC) processes & product releases.
  • Executive management approval committee member for Patent filings.
  • Experienced in M&A for IP acquisition.
  • Target market segment and applications.
  • P/L.
Picture of Daniel CHOY
Daniel Choy - Commercial Excellence
  • 26+ years in Semiconductor industry.
  • Field General Manager, Applied Materials.
  • Key Global Customer Accounts management including Capex sales, service business, leading service, process and applications teams on field support.
  • Experienced in M&A integration teams focusing on customer group – sales and business processes.
Eloi DELORME
Eloi Delorme - Executive Consultant (external)
  • Over 25 years in the Semicon industry.
  • Served in a variety of roles at Chartered (GloFo), KLA-Tencor (15years) & Nanometrics (ONTO).
  • Experience in Front End Wafer Fab Defect/Yield, M&I Equipment, Strategic Marketing/M&A.
Discover our commitments