WE ENABLE OUR CUSTOMERS TO YIELD HIGHER & FASTER

WHO ARE UNITYSC?

UnitySC was formed in 2016, by a combination of European companies. Headquarted in France, UnitySC has a worldwide footprint, with staff in every major chip producing region.

WHAT DOES UNITYSC MAKE? 

UnitySC is a leader in creating Metrology & Inspection tools used for Advanced Packaging (TSVs, High BandWidth Memory Chip stacks, Hybrid-Bonding/Wafer2Wafer, Die2Wafer) & MEM’s.

We also make equipment for unpatterend wafer defect inspection (all types of Compound-semi substrates like GaN, GaAs, InP, SiC, Glass, Sapphire, Ge, Silicon). 

Plus other Metrology & Inspection equipment for other use-cases, all of which are used by our customers for yield improvement.

WORKING AT UNITYSC

At UnitySC, we promote and support from a diverse talent pool. We are pushing the frontiers of technology, making us an attractive place to work that allows all our employees to grow and succeed.

UNITYSC’S SERVICES

UnitySC are able to offer resources for Service & Applications Support for our equipment to customers all over the world.

We provide a comprehensive range of maintenance, upgrade and other services, depending on your requirements. Through these services, we can continuously maintain the health of your tools over their lifetimes.

Our Spare Parts Team offers a quick and reliable service to keep your production lines moving.

EXAMPLES OF OUR CUSTOMERS’ END MARKETS

Automotive

The move from ICE vehicles to E-vehicles, Autonomous driving (eg; ADAS), in-car-tech, digital connectivity & security. All these trends have one common enabler: Semiconductor components.

High-Bandwidth Memory (HBM)

High-Performance Computing (HPC)

AI-driven data analytics require real-time data processing at scale. UnitySC optimizes Semiconductor industry computing and memory architectures (GPU & CPU) for efficient handling of large and time-critical datasets.

Enhancing overall performance in data analytics, more efficiently and securely handled.

Internet Of Things

IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the world of tomorrow. In short, more & more physical products will contain more & more chips of all types of functions.

AI & Augmented

Virtual Reality

Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences.

These technologies require smaller form factors, higher performance chip-materials and novel packaging approaches.

What’s new

Press releases

Paul Boudre appointed chairman of UnitySC

UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors. Paul Boudre was the CEO of Soitec [EPA:SOI], a world...

Events

Meet UnitySC during SEMICON Korea

Mr Sungtae Kim, our Korean Key Account Director, and his team will be ready to meet you at SEMICON Korea, the key meeting on semiconductor market. Then event will be held from the 5th to the 7th of February 2020, at the Korea World Trade Tower, #4205, 511,...

UnitySC in Munich this week

UnitySC was represented during two important events this week : Our Key Account Managers Mr Yves Budillon, and Mr Gilles Vera have hold a booth during the SEMICON Europa in Munich from the 12th to the 15th of November. They have been joined by our Product Line Manager...

News