BIG NEWS!
Unity-SC is now part of the Electronics business of Merck KGaA, Darmstadt, Germany
Where Metrology & Inspection Meet Materials Intelligence™
WE ENABLE OUR CUSTOMERS TO YIELD HIGHER & FASTER
WHO ARE UNITYSC?
UnitySC was formed in 2016, by a combination of European companies. Headquarted in France, UnitySC has a worldwide footprint, with staff in every major chip producing region.
WHAT DOES UNITYSC MAKE?
UnitySC is a leader in creating Metrology & Inspection tools used for Advanced Packaging (TSVs, High BandWidth Memory Chip stacks, Hybrid-Bonding/Wafer2Wafer, Die2Wafer) & MEM’s.
We also make equipment for unpatterend wafer defect inspection (all types of Compound-semi substrates like GaN, GaAs, InP, SiC, Glass, Sapphire, Ge, Silicon).
Plus other Metrology & Inspection equipment for other use-cases, all of which are used by our customers for yield improvement.
WORKING AT UNITYSC
At UnitySC, we promote and support from a diverse talent pool. We are pushing the frontiers of technology, making us an attractive place to work that allows all our employees to grow and succeed.
UNITYSC’S SERVICES
UnitySC are able to offer resources for Service & Applications Support for our equipment to customers all over the world.
We provide a comprehensive range of maintenance, upgrade and other services, depending on your requirements. Through these services, we can continuously maintain the health of your tools over their lifetimes.
Our Spare Parts Team offers a quick and reliable service to keep your production lines moving.
EXAMPLES OF OUR CUSTOMERS’ END MARKETS
Automotive
The move from ICE vehicles to E-vehicles, Autonomous driving (eg; ADAS), in-car-tech, digital connectivity & security. All these trends have one common enabler: Semiconductor components.
High-Bandwidth Memory (HBM)
High-Performance Computing (HPC)
AI-driven data analytics require real-time data processing at scale. UnitySC optimizes Semiconductor industry computing and memory architectures (GPU & CPU) for efficient handling of large and time-critical datasets.
Enhancing overall performance in data analytics, more efficiently and securely handled.
Internet Of Things
IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the world of tomorrow. In short, more & more physical products will contain more & more chips of all types of functions.
AI & Augmented
Virtual Reality
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences.
These technologies require smaller form factors, higher performance chip-materials and novel packaging approaches.
What’s new
Press releases
Paul Boudre appointed chairman of UnitySC
UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors. Paul Boudre was the CEO of Soitec [EPA:SOI], a world...
UnitySC raises EUR 48 million with Jolt Capital, the French State and Supernova Invest
UnitySC, the leading provider of metrology and inspection equipment for the semiconductor industry, today announces a successful EUR 48 million funding round led by Jolt Capital, the French State through French Tech Souveraineté (a program operated by Bpifrance) and...
Events
UnitySC at Power Electronics and Packaging Technical Workshop
UnitySC will have a booth during the Power Electronics and Packaging Technical Workshop on the 28th November 2019 in Tours, France. Our Product Managers, Mrs Louise Decoin and our Key Account Diector for South Europe, Mr Gilles Vera, will be there to meet you and...
Process Control solutions for Advanced Packaging – Advanced Semiconductor Technology Conference
During the ASTC conference held in Marina Bay Sands Convention Centre - Singapore, the 7th and 8th of November 2019, Unity Semiconductor will present a paper entitled : Process Control solutions for Advanced Packaging You can already read below...
News
Case Study : Unlocking Yield in Die2Die Stack HBM / AI-chip Manufacturing
In the semiconductor industry, where even the slightest microscopic imperfection can compromise an entire production, defect detection & metrology are not just desired but essential. This case study showcases how advanced optical inspection technologies from Unity...
Introducing TMAP: Cutting-Edge Optical Metrology from France with UnitySC
Precision in semiconductor manufacturing is non-negotiable. As features shrink and designs become more complex, the demand for precise metrology has never been greater. TMAP by UnitySC offers a comprehensive optical metrology solution, tailored to meet the exacting...