WE ENABLE OUR CUSTOMERS TO YIELD HIGHER & FASTER

WHO ARE UNITYSC?

UnitySC was formed in 2016, by a combination of European companies. Headquarted in France, UnitySC has a worldwide footprint, with staff in every major chip producing region.

WHAT DOES UNITYSC MAKE? 

UnitySC is a leader in creating Metrology & Inspection tools used for Advanced Packaging (TSVs, High BandWidth Memory Chip stacks, Hybrid-Bonding/Wafer2Wafer, Die2Wafer) & MEM’s.

We also make equipment for unpatterend wafer defect inspection (all types of Compound-semi substrates like GaN, GaAs, InP, SiC, Glass, Sapphire, Ge, Silicon). 

Plus other Metrology & Inspection equipment for other use-cases, all of which are used by our customers for yield improvement.

WORKING AT UNITYSC

At UnitySC, we promote and support from a diverse talent pool. We are pushing the frontiers of technology, making us an attractive place to work that allows all our employees to grow and succeed.

UNITYSC’S SERVICES

UnitySC are able to offer resources for Service & Applications Support for our equipment to customers all over the world.

We provide a comprehensive range of maintenance, upgrade and other services, depending on your requirements. Through these services, we can continuously maintain the health of your tools over their lifetimes.

Our Spare Parts Team offers a quick and reliable service to keep your production lines moving.

EXAMPLES OF OUR CUSTOMERS’ END MARKETS

Automotive

The move from ICE vehicles to E-vehicles, Autonomous driving (eg; ADAS), in-car-tech, digital connectivity & security. All these trends have one common enabler: Semiconductor components.

High-Bandwidth Memory (HBM)

High-Performance Computing (HPC)

AI-driven data analytics require real-time data processing at scale. UnitySC optimizes Semiconductor industry computing and memory architectures (GPU & CPU) for efficient handling of large and time-critical datasets.

Enhancing overall performance in data analytics, more efficiently and securely handled.

Internet Of Things

IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the world of tomorrow. In short, more & more physical products will contain more & more chips of all types of functions.

AI & Augmented

Virtual Reality

Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences.

These technologies require smaller form factors, higher performance chip-materials and novel packaging approaches.

What’s new

Press releases

UnitySC names Kamel Ait-Mahiout as CEO

Ait-Mahiout Brings Strong Track Record of Growth at Amkor Europe and Significant Operational Experience Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced...

Events

IWLPC

San Jose, CA Wafer Level Packaging is almost everywhere: smartphones, automotive, IoT, medtech, etc... Meet with us at IWLPC on booth #10 and listen to our talk entitled "Wafer Thinning In-Line Inspection Process Control Solution for High Volume Manufacturing". To...

IMAPS 2017

Raleigh, NC UnitySC will be exhibiting on booth #421 and delivering a talk entitled "In line Advanced Process Control Solution for the Fabrication of Micro-bumps". Come to meet with us. To pre-arrange a meeting, send us a message.

News