WE ENABLE OUR CUSTOMERS TO YIELD HIGHER & FASTER
WHO ARE UNITYSC?
UnitySC was formed in 2016, by a combination of European companies. Headquarted in France, UnitySC has a worldwide footprint, with staff in every major chip producing region.
WHAT DOES UNITYSC MAKE?
UnitySC is a leader in creating Metrology & Inspection tools used for Advanced Packaging (TSVs, High BandWidth Memory Chip stacks, Hybrid-Bonding/Wafer2Wafer, Die2Wafer) & MEM’s.
We also make equipment for unpatterend wafer defect inspection (all types of Compound-semi substrates like GaN, GaAs, InP, SiC, Glass, Sapphire, Ge, Silicon).
Plus other Metrology & Inspection equipment for other use-cases, all of which are used by our customers for yield improvement.
WORKING AT UNITYSC
At UnitySC, we promote and support from a diverse talent pool. We are pushing the frontiers of technology, making us an attractive place to work that allows all our employees to grow and succeed.
UNITYSC’S SERVICES
UnitySC are able to offer resources for Service & Applications Support for our equipment to customers all over the world.
We provide a comprehensive range of maintenance, upgrade and other services, depending on your requirements. Through these services, we can continuously maintain the health of your tools over their lifetimes.
Our Spare Parts Team offers a quick and reliable service to keep your production lines moving.
EXAMPLES OF OUR CUSTOMERS’ END MARKETS
Automotive
The move from ICE vehicles to E-vehicles, Autonomous driving (eg; ADAS), in-car-tech, digital connectivity & security. All these trends have one common enabler: Semiconductor components.
High-Bandwidth Memory (HBM)
High-Performance Computing (HPC)
AI-driven data analytics require real-time data processing at scale. UnitySC optimizes Semiconductor industry computing and memory architectures (GPU & CPU) for efficient handling of large and time-critical datasets.
Enhancing overall performance in data analytics, more efficiently and securely handled.
Internet Of Things
IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the world of tomorrow. In short, more & more physical products will contain more & more chips of all types of functions.
AI & Augmented
Virtual Reality
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences.
These technologies require smaller form factors, higher performance chip-materials and novel packaging approaches.
What’s new
Press releases
UnitySC names Kamel Ait-Mahiout as CEO
Ait-Mahiout Brings Strong Track Record of Growth at Amkor Europe and Significant Operational Experience Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced...
Unitysc Acquires Hseb Dresden Gmbh to Become a Global Leader in Semiconductor Process Control
Combined Core Competencies Deliver comprehensive Inspection and Metrology Offering for FULL SPECTRUM OF SEMICONDUCTOR APPLICATIONS Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of...
Events
IWLPC
San Jose, CA Wafer Level Packaging is almost everywhere: smartphones, automotive, IoT, medtech, etc... Meet with us at IWLPC on booth #10 and listen to our talk entitled "Wafer Thinning In-Line Inspection Process Control Solution for High Volume Manufacturing". To...
IMAPS 2017
Raleigh, NC UnitySC will be exhibiting on booth #421 and delivering a talk entitled "In line Advanced Process Control Solution for the Fabrication of Micro-bumps". Come to meet with us. To pre-arrange a meeting, send us a message.
News
UnitySC Opens a New Office in South Korea
We are pleased to announce that UnitySC has expanded to open a new office in South Korea ! UnitySC has officially opened a new office in Yongin-si, South Korea, the 28th of October 2019. As part of the strategy and worldwide growth, UnitySC is expanding locally its...
“Technologies development driven by MEMS challenges” at MEMS World Summit 2019
Mr Mathieu NOEL, Product Line Manager for Metrology solutions at UnitySC, will present a paper during the MEMS World Summit, the 11th and 12th November 2019 at the Hilton Munich Park Hotel. The paper subject will be "Technologies development driven by MEMS...