WE ENABLE OUR CUSTOMERS TO YIELD HIGHER & FASTER
WHO ARE UNITYSC?
UnitySC was formed in 2016, by a combination of European companies. Headquarted in France, UnitySC has a worldwide footprint, with staff in every major chip producing region.
WHAT DOES UNITYSC MAKE?
UnitySC is a leader in creating Metrology & Inspection tools used for Advanced Packaging (TSVs, High BandWidth Memory Chip stacks, Hybrid-Bonding/Wafer2Wafer, Die2Wafer) & MEM’s.
We also make equipment for unpatterend wafer defect inspection (all types of Compound-semi substrates like GaN, GaAs, InP, SiC, Glass, Sapphire, Ge, Silicon).
Plus other Metrology & Inspection equipment for other use-cases, all of which are used by our customers for yield improvement.
WORKING AT UNITYSC
At UnitySC, we promote and support from a diverse talent pool. We are pushing the frontiers of technology, making us an attractive place to work that allows all our employees to grow and succeed.
UNITYSC’S SERVICES
UnitySC are able to offer resources for Service & Applications Support for our equipment to customers all over the world.
We provide a comprehensive range of maintenance, upgrade and other services, depending on your requirements. Through these services, we can continuously maintain the health of your tools over their lifetimes.
Our Spare Parts Team offers a quick and reliable service to keep your production lines moving.
EXAMPLES OF OUR CUSTOMERS’ END MARKETS
Automotive
The move from ICE vehicles to E-vehicles, Autonomous driving (eg; ADAS), in-car-tech, digital connectivity & security. All these trends have one common enabler: Semiconductor components.
High-Bandwidth Memory (HBM)
High-Performance Computing (HPC)
AI-driven data analytics require real-time data processing at scale. UnitySC optimizes Semiconductor industry computing and memory architectures (GPU & CPU) for efficient handling of large and time-critical datasets.
Enhancing overall performance in data analytics, more efficiently and securely handled.
Internet Of Things
IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the world of tomorrow. In short, more & more physical products will contain more & more chips of all types of functions.
AI & Augmented
Virtual Reality
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences.
These technologies require smaller form factors, higher performance chip-materials and novel packaging approaches.
What’s new
Press releases
IMAPS Conference in Boston (Sept 30- Oct 3)
During the 52th IMAPS conference held in Boston from the 30th of September until the 3rd of October, Unity Semiconductor will present a paper entitled : How to secure the fabrication of Gallium Nitride on Si wafers You can already read below an abstract of what we...
ASMC Conference – Optical profilometry and AFM measurements comparison on low amplitude deterministic surfaces
Dr Carlos Beitia from CEA LETI has presented a paper about advanced metrology in collaboration with Unity during the Advanced Semiconductor Manufacturing Conference in New york. New York, 6th-9th May 2019- Surface nanotopography is important for different key advanced...
Events
2018 IEEE 68th Electronic Components and Technology Conference
San Diego, California This year again, UnitySC is proud to be Gold Sponsor of ECTC which brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. We will be...
IMAPS Device Packaging 2018
Fountain Hills, Arizona UnitySC will be exhibiting on booth #60. Dario Alliata, Product Manager will also deliver two talks respectively entitled Progress in Time-Domain Optical Coherence Tomography for TSV/3Di stacking Metrology and Wafer Nano Topography and Edge...
News
Mohamad’s Journey: From the Application Development field to a Leader & Product Gatekeeper at UnitySC
Mohamad, a former research engineer at CEA Grenoble, discovered UnitySC in 2018 through a collaborative project, capturing his heart and leading him to join as a Junior Application Engineer. Pioneering Role in Metrology Assigned to showcase Metrology tools at...
SOCOTEC Certification France is now the designated certification body for UnitySC’s ISO 9001:2015 and ISO 14001:2015 standards, further solidifying an established partnership.
With a sense of satisfaction, UnitySC announces the commencement of a new chapter in collaboration with SOCOTEC Certification France since July 19, 2023, while maintaining its unchanged ISO 9001:2015 and ISO 14001:2015 certifications. These standards signify the...